Researchers combine numerical modeling with neural networks to show how nanodiamond aggregation, magnetic fields, and surface ...
University of Houston researchers have made a discovery in thermal conductivity that overturns an existing theory that boron arsenide (BAs) couldn't compete with the heat conduction of a diamond.
New Software Development Kit Brings High-Performance Thermal Simulation And GPU-Accelerated Speed To Integrated Engineering Workflows. MONTREAL, March 11, 2026 /CNW/ - Maya HTT today announced the ...
As three-dimensional integrated circuit (3D-IC) technology becomes the architectural backbone of AI, high-performance computing (HPC), and advanced edge systems, thermal management has shifted from a ...
Analog fabs are bolstering their electronic design automation (EDA) tool repository to complement design flows in advanced RF devices, and the latest example comes from Tower Semiconductor’s adoption ...
Semiconductors are a key component in smartphones, televisions, and other devices used in daily life using these devices generates heat, resulting in performance degradation and a shorter product life ...
Tom's Hardware on MSN
Thermal pads with vapor chambers have 50 to 80 times better thermal conductivity than normal pads
The company also showed off a non-metal vapor chamber for phones.
Researchers have solved a long-standing puzzle about lower measured thermal conductivity values of cubic silicon carbide (3C-SiC) bulk crystals in the literature than the structurally more complex ...
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